Kconfig 17 KB

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  1. #
  2. # Generic thermal sysfs drivers configuration
  3. #
  4. menuconfig THERMAL
  5. tristate "Generic Thermal sysfs driver"
  6. help
  7. Generic Thermal Sysfs driver offers a generic mechanism for
  8. thermal management. Usually it's made up of one or more thermal
  9. zone and cooling device.
  10. Each thermal zone contains its own temperature, trip points,
  11. cooling devices.
  12. All platforms with ACPI thermal support can use this driver.
  13. If you want this support, you should say Y or M here.
  14. if THERMAL
  15. config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
  16. int "Emergency poweroff delay in milli-seconds"
  17. depends on THERMAL
  18. default 0
  19. help
  20. Thermal subsystem will issue a graceful shutdown when
  21. critical temperatures are reached using orderly_poweroff(). In
  22. case of failure of an orderly_poweroff(), the thermal emergency
  23. poweroff kicks in after a delay has elapsed and shuts down the system.
  24. This config is number of milliseconds to delay before emergency
  25. poweroff kicks in. Similarly to the critical trip point,
  26. the delay should be carefully profiled so as to give adequate
  27. time for orderly_poweroff() to finish on regular execution.
  28. If set to 0 emergency poweroff will not be supported.
  29. In doubt, leave as 0.
  30. config THERMAL_HWMON
  31. bool
  32. prompt "Expose thermal sensors as hwmon device"
  33. depends on HWMON=y || HWMON=THERMAL
  34. default y
  35. help
  36. In case a sensor is registered with the thermal
  37. framework, this option will also register it
  38. as a hwmon. The sensor will then have the common
  39. hwmon sysfs interface.
  40. Say 'Y' here if you want all thermal sensors to
  41. have hwmon sysfs interface too.
  42. config THERMAL_OF
  43. bool
  44. prompt "APIs to parse thermal data out of device tree"
  45. depends on OF
  46. default y
  47. help
  48. This options provides helpers to add the support to
  49. read and parse thermal data definitions out of the
  50. device tree blob.
  51. Say 'Y' here if you need to build thermal infrastructure
  52. based on device tree.
  53. config THERMAL_WRITABLE_TRIPS
  54. bool "Enable writable trip points"
  55. help
  56. This option allows the system integrator to choose whether
  57. trip temperatures can be changed from userspace. The
  58. writable trips need to be specified when setting up the
  59. thermal zone but the choice here takes precedence.
  60. Say 'Y' here if you would like to allow userspace tools to
  61. change trip temperatures.
  62. choice
  63. prompt "Default Thermal governor"
  64. default THERMAL_DEFAULT_GOV_STEP_WISE
  65. help
  66. This option sets which thermal governor shall be loaded at
  67. startup. If in doubt, select 'step_wise'.
  68. config THERMAL_DEFAULT_GOV_BACKWARD_COMPATIBLE
  69. bool "backward_compatible"
  70. select THERMAL_BACKWARD_COMPATIBLE
  71. help
  72. Use the backward_compatible governor as default. This throttles the
  73. devices when the temperature is over each trip point.
  74. Backward-compatible governor resembles the behaviors of thermal
  75. framework in Linux kernel 2.6. It sets cooler states whenever
  76. temperature is updated no meter cooler state change or not.
  77. config THERMAL_DEFAULT_GOV_STEP_WISE
  78. bool "step_wise"
  79. select THERMAL_GOV_STEP_WISE
  80. help
  81. Use the step_wise governor as default. This throttles the
  82. devices one step at a time.
  83. config THERMAL_DEFAULT_GOV_FAIR_SHARE
  84. bool "fair_share"
  85. select THERMAL_GOV_FAIR_SHARE
  86. help
  87. Use the fair_share governor as default. This throttles the
  88. devices based on their 'contribution' to a zone. The
  89. contribution should be provided through platform data.
  90. config THERMAL_DEFAULT_GOV_USER_SPACE
  91. bool "user_space"
  92. select THERMAL_GOV_USER_SPACE
  93. help
  94. Select this if you want to let the user space manage the
  95. platform thermals.
  96. config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  97. bool "power_allocator"
  98. select THERMAL_GOV_POWER_ALLOCATOR
  99. help
  100. Select this if you want to control temperature based on
  101. system and device power allocation. This governor can only
  102. operate on cooling devices that implement the power API.
  103. endchoice
  104. config THERMAL_BACKWARD_COMPATIBLE
  105. bool "Backward-compatible thermal governor"
  106. help
  107. Enable this to manage platform thermals using backward-compatible governor.
  108. Backward-compatible governor resembles the behaviors of thermal
  109. framework in Linux kernel 2.6. It sets cooler states whenever
  110. temperature is updated no meter cooler state change or not.
  111. config THERMAL_GOV_FAIR_SHARE
  112. bool "Fair-share thermal governor"
  113. help
  114. Enable this to manage platform thermals using fair-share governor.
  115. config THERMAL_GOV_STEP_WISE
  116. bool "Step_wise thermal governor"
  117. help
  118. Enable this to manage platform thermals using a simple linear
  119. governor.
  120. config THERMAL_GOV_BANG_BANG
  121. bool "Bang Bang thermal governor"
  122. default n
  123. help
  124. Enable this to manage platform thermals using bang bang governor.
  125. Say 'Y' here if you want to use two point temperature regulation
  126. used for fans without throttling. Some fan drivers depend on this
  127. governor to be enabled (e.g. acerhdf).
  128. config THERMAL_GOV_USER_SPACE
  129. bool "User_space thermal governor"
  130. help
  131. Enable this to let the user space manage the platform thermals.
  132. config THERMAL_GOV_POWER_ALLOCATOR
  133. bool "Power allocator thermal governor"
  134. help
  135. Enable this to manage platform thermals by dynamically
  136. allocating and limiting power to devices.
  137. config CPU_THERMAL
  138. bool "generic cpu cooling support"
  139. depends on CPU_FREQ
  140. depends on THERMAL_OF
  141. help
  142. This implements the generic cpu cooling mechanism through frequency
  143. reduction. An ACPI version of this already exists
  144. (drivers/acpi/processor_thermal.c).
  145. This will be useful for platforms using the generic thermal interface
  146. and not the ACPI interface.
  147. If you want this support, you should say Y here.
  148. config CLOCK_THERMAL
  149. bool "Generic clock cooling support"
  150. depends on COMMON_CLK
  151. depends on PM_OPP
  152. help
  153. This entry implements the generic clock cooling mechanism through
  154. frequency clipping. Typically used to cool off co-processors. The
  155. device that is configured to use this cooling mechanism will be
  156. controlled to reduce clock frequency whenever temperature is high.
  157. config DEVFREQ_THERMAL
  158. bool "Generic device cooling support"
  159. depends on PM_DEVFREQ
  160. depends on PM_OPP
  161. help
  162. This implements the generic devfreq cooling mechanism through
  163. frequency reduction for devices using devfreq.
  164. This will throttle the device by limiting the maximum allowed DVFS
  165. frequency corresponding to the cooling level.
  166. In order to use the power extensions of the cooling device,
  167. devfreq should use the simple_ondemand governor.
  168. If you want this support, you should say Y here.
  169. config THERMAL_EMULATION
  170. bool "Thermal emulation mode support"
  171. help
  172. Enable this option to make a emul_temp sysfs node in thermal zone
  173. directory to support temperature emulation. With emulation sysfs node,
  174. user can manually input temperature and test the different trip
  175. threshold behaviour for simulation purpose.
  176. WARNING: Be careful while enabling this option on production systems,
  177. because userland can easily disable the thermal policy by simply
  178. flooding this sysfs node with low temperature values.
  179. config HISI_THERMAL
  180. tristate "Hisilicon thermal driver"
  181. depends on ARCH_HISI || COMPILE_TEST
  182. depends on HAS_IOMEM
  183. depends on OF
  184. default y
  185. help
  186. Enable this to plug hisilicon's thermal sensor driver into the Linux
  187. thermal framework. cpufreq is used as the cooling device to throttle
  188. CPUs when the passive trip is crossed.
  189. config IMX_THERMAL
  190. tristate "Temperature sensor driver for Freescale i.MX SoCs"
  191. depends on (ARCH_MXC && CPU_THERMAL) || COMPILE_TEST
  192. depends on MFD_SYSCON
  193. depends on OF
  194. help
  195. Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
  196. It supports one critical trip point and one passive trip point. The
  197. cpufreq is used as the cooling device to throttle CPUs when the
  198. passive trip is crossed.
  199. config MAX77620_THERMAL
  200. tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
  201. depends on MFD_MAX77620
  202. depends on OF
  203. help
  204. Support for die junction temperature warning alarm for Maxim
  205. Semiconductor PMIC MAX77620 device. Device generates two alarm
  206. interrupts when PMIC die temperature cross the threshold of
  207. 120 degC and 140 degC.
  208. config QORIQ_THERMAL
  209. tristate "QorIQ Thermal Monitoring Unit"
  210. depends on THERMAL_OF
  211. depends on HAS_IOMEM
  212. help
  213. Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
  214. It supports one critical trip point and one passive trip point. The
  215. cpufreq is used as the cooling device to throttle CPUs when the
  216. passive trip is crossed.
  217. config SPEAR_THERMAL
  218. tristate "SPEAr thermal sensor driver"
  219. depends on PLAT_SPEAR || COMPILE_TEST
  220. depends on HAS_IOMEM
  221. depends on OF
  222. help
  223. Enable this to plug the SPEAr thermal sensor driver into the Linux
  224. thermal framework.
  225. config ROCKCHIP_THERMAL
  226. tristate "Rockchip thermal driver"
  227. depends on ARCH_ROCKCHIP || COMPILE_TEST
  228. depends on RESET_CONTROLLER
  229. depends on HAS_IOMEM
  230. help
  231. Rockchip thermal driver provides support for Temperature sensor
  232. ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
  233. trip point. Cpufreq is used as the cooling device and will throttle
  234. CPUs when the Temperature crosses the passive trip point.
  235. config RCAR_THERMAL
  236. tristate "Renesas R-Car thermal driver"
  237. depends on ARCH_RENESAS || COMPILE_TEST
  238. depends on HAS_IOMEM
  239. help
  240. Enable this to plug the R-Car thermal sensor driver into the Linux
  241. thermal framework.
  242. config RCAR_GEN3_THERMAL
  243. tristate "Renesas R-Car Gen3 thermal driver"
  244. depends on ARCH_RENESAS || COMPILE_TEST
  245. depends on HAS_IOMEM
  246. depends on OF
  247. help
  248. Enable this to plug the R-Car Gen3 thermal sensor driver into the Linux
  249. thermal framework.
  250. config KIRKWOOD_THERMAL
  251. tristate "Temperature sensor on Marvell Kirkwood SoCs"
  252. depends on MACH_KIRKWOOD || COMPILE_TEST
  253. depends on HAS_IOMEM
  254. depends on OF
  255. help
  256. Support for the Kirkwood thermal sensor driver into the Linux thermal
  257. framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
  258. config DOVE_THERMAL
  259. tristate "Temperature sensor on Marvell Dove SoCs"
  260. depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
  261. depends on HAS_IOMEM
  262. depends on OF
  263. help
  264. Support for the Dove thermal sensor driver in the Linux thermal
  265. framework.
  266. config DB8500_THERMAL
  267. tristate "DB8500 thermal management"
  268. depends on MFD_DB8500_PRCMU
  269. default y
  270. help
  271. Adds DB8500 thermal management implementation according to the thermal
  272. management framework. A thermal zone with several trip points will be
  273. created. Cooling devices can be bound to the trip points to cool this
  274. thermal zone if trip points reached.
  275. config ARMADA_THERMAL
  276. tristate "Armada 370/XP thermal management"
  277. depends on ARCH_MVEBU || COMPILE_TEST
  278. depends on HAS_IOMEM
  279. depends on OF
  280. help
  281. Enable this option if you want to have support for thermal management
  282. controller present in Armada 370 and Armada XP SoC.
  283. config DA9062_THERMAL
  284. tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
  285. depends on MFD_DA9062 || COMPILE_TEST
  286. depends on OF
  287. help
  288. Enable this for the Dialog Semiconductor thermal sensor driver.
  289. This will report PMIC junction over-temperature for one thermal trip
  290. zone.
  291. Compatible with the DA9062 and DA9061 PMICs.
  292. config INTEL_POWERCLAMP
  293. tristate "Intel PowerClamp idle injection driver"
  294. depends on THERMAL
  295. depends on X86
  296. depends on CPU_SUP_INTEL
  297. help
  298. Enable this to enable Intel PowerClamp idle injection driver. This
  299. enforce idle time which results in more package C-state residency. The
  300. user interface is exposed via generic thermal framework.
  301. config X86_PKG_TEMP_THERMAL
  302. tristate "X86 package temperature thermal driver"
  303. depends on X86_THERMAL_VECTOR
  304. select THERMAL_GOV_USER_SPACE
  305. select THERMAL_WRITABLE_TRIPS
  306. default m
  307. help
  308. Enable this to register CPU digital sensor for package temperature as
  309. thermal zone. Each package will have its own thermal zone. There are
  310. two trip points which can be set by user to get notifications via thermal
  311. notification methods.
  312. config INTEL_SOC_DTS_IOSF_CORE
  313. tristate
  314. depends on X86 && PCI
  315. select IOSF_MBI
  316. help
  317. This is becoming a common feature for Intel SoCs to expose the additional
  318. digital temperature sensors (DTSs) using side band interface (IOSF). This
  319. implements the common set of helper functions to register, get temperature
  320. and get/set thresholds on DTSs.
  321. config INTEL_SOC_DTS_THERMAL
  322. tristate "Intel SoCs DTS thermal driver"
  323. depends on X86 && PCI
  324. select INTEL_SOC_DTS_IOSF_CORE
  325. select THERMAL_WRITABLE_TRIPS
  326. help
  327. Enable this to register Intel SoCs (e.g. Bay Trail) platform digital
  328. temperature sensor (DTS). These SoCs have two additional DTSs in
  329. addition to DTSs on CPU cores. Each DTS will be registered as a
  330. thermal zone. There are two trip points. One of the trip point can
  331. be set by user mode programs to get notifications via Linux thermal
  332. notification methods.The other trip is a critical trip point, which
  333. was set by the driver based on the TJ MAX temperature.
  334. config INTEL_QUARK_DTS_THERMAL
  335. tristate "Intel Quark DTS thermal driver"
  336. depends on X86_INTEL_QUARK
  337. help
  338. Enable this to register Intel Quark SoC (e.g. X1000) platform digital
  339. temperature sensor (DTS). For X1000 SoC, it has one on-die DTS.
  340. The DTS will be registered as a thermal zone. There are two trip points:
  341. hot & critical. The critical trip point default value is set by
  342. underlying BIOS/Firmware.
  343. menu "ACPI INT340X thermal drivers"
  344. source drivers/thermal/int340x_thermal/Kconfig
  345. endmenu
  346. config INTEL_BXT_PMIC_THERMAL
  347. tristate "Intel Broxton PMIC thermal driver"
  348. depends on X86 && INTEL_SOC_PMIC_BXTWC && REGMAP
  349. help
  350. Select this driver for Intel Broxton PMIC with ADC channels monitoring
  351. system temperature measurements and alerts.
  352. This driver is used for monitoring the ADC channels of PMIC and handles
  353. the alert trip point interrupts and notifies the thermal framework with
  354. the trip point and temperature details of the zone.
  355. config INTEL_PCH_THERMAL
  356. tristate "Intel PCH Thermal Reporting Driver"
  357. depends on X86 && PCI
  358. help
  359. Enable this to support thermal reporting on certain intel PCHs.
  360. Thermal reporting device will provide temperature reading,
  361. programmable trip points and other information.
  362. config MTK_THERMAL
  363. tristate "Temperature sensor driver for mediatek SoCs"
  364. depends on ARCH_MEDIATEK || COMPILE_TEST
  365. depends on HAS_IOMEM
  366. depends on NVMEM || NVMEM=n
  367. depends on RESET_CONTROLLER
  368. default y
  369. help
  370. Enable this option if you want to have support for thermal management
  371. controller present in Mediatek SoCs
  372. menu "Broadcom thermal drivers"
  373. depends on ARCH_BCM || ARCH_BCM2835 || COMPILE_TEST
  374. source "drivers/thermal/broadcom/Kconfig"
  375. endmenu
  376. menu "Texas Instruments thermal drivers"
  377. depends on ARCH_HAS_BANDGAP || COMPILE_TEST
  378. depends on HAS_IOMEM
  379. source "drivers/thermal/ti-soc-thermal/Kconfig"
  380. endmenu
  381. menu "Samsung thermal drivers"
  382. depends on ARCH_EXYNOS || COMPILE_TEST
  383. source "drivers/thermal/samsung/Kconfig"
  384. endmenu
  385. menu "STMicroelectronics thermal drivers"
  386. depends on ARCH_STI && OF
  387. source "drivers/thermal/st/Kconfig"
  388. endmenu
  389. config TANGO_THERMAL
  390. tristate "Tango thermal management"
  391. depends on ARCH_TANGO || COMPILE_TEST
  392. help
  393. Enable the Tango thermal driver, which supports the primitive
  394. temperature sensor embedded in Tango chips since the SMP8758.
  395. This sensor only generates a 1-bit signal to indicate whether
  396. the die temperature exceeds a programmable threshold.
  397. source "drivers/thermal/tegra/Kconfig"
  398. config QCOM_SPMI_TEMP_ALARM
  399. tristate "Qualcomm SPMI PMIC Temperature Alarm"
  400. depends on OF && SPMI && IIO
  401. select REGMAP_SPMI
  402. help
  403. This enables a thermal sysfs driver for Qualcomm plug-and-play (QPNP)
  404. PMIC devices. It shows up in sysfs as a thermal sensor with multiple
  405. trip points. The temperature reported by the thermal sensor reflects the
  406. real time die temperature if an ADC is present or an estimate of the
  407. temperature based upon the over temperature stage value.
  408. config GENERIC_ADC_THERMAL
  409. tristate "Generic ADC based thermal sensor"
  410. depends on IIO
  411. help
  412. This enabled a thermal sysfs driver for the temperature sensor
  413. which is connected to the General Purpose ADC. The ADC channel
  414. is read via IIO framework and the channel information is provided
  415. to this driver. This driver reports the temperature by reading ADC
  416. channel and converts it to temperature based on lookup table.
  417. menu "Qualcomm thermal drivers"
  418. depends on (ARCH_QCOM && OF) || COMPILE_TEST
  419. source "drivers/thermal/qcom/Kconfig"
  420. endmenu
  421. config ZX2967_THERMAL
  422. tristate "Thermal sensors on zx2967 SoC"
  423. depends on ARCH_ZX || COMPILE_TEST
  424. help
  425. Enable the zx2967 thermal sensors driver, which supports
  426. the primitive temperature sensor embedded in zx2967 SoCs.
  427. This sensor generates the real time die temperature.
  428. config UNIPHIER_THERMAL
  429. tristate "Socionext UniPhier thermal driver"
  430. depends on ARCH_UNIPHIER || COMPILE_TEST
  431. depends on THERMAL_OF && MFD_SYSCON
  432. help
  433. Enable this to plug in UniPhier on-chip PVT thermal driver into the
  434. thermal framework. The driver supports CPU thermal zone temperature
  435. reporting and a couple of trip points.
  436. endif